Current

Sponsors: NSF, Society for Engineering Education, Stanford Office of Science Outreach Heat transfer instruction has experienced importance changes over the past two decades with the increasing relevance of new disciplines of science, such as solid state physics, and the importance of small lengthscales. The mechanical engineering undergraduate experience needs to evolve in response to these [...]

Sponsors: SRC, SRC ASCENT Students: Heungdong Kwon, Dr. Joe Katz Interface thermal transport is arguably the leading fundamental challenge for the design and implementation of advanced nanostructure technologies for energy conversion, computation, and data storage. A leading problem is multicarrier interfacial transport (electron & phonon nonequilibrium), which is distinct from the single-carrier focus of prior [...]

Sponsors: NSF, Intel, NXP, Ovonyx, SRC Collaborators: H.S.P. Wong group, Stanford EE Students: Dr. Joe Katz, Dr. Aditya Sood Phase change memory (PCM or PCRAM) is based on rapid, thermally-induced phase transitions in Ge2Sb2Te5 (GST) and related compounds. Because the phase change is induced by temperature changes, thermal conduction and thermally-induced phase transitions govern the [...]

Sponsors: Analog Devices, NSF POETS Center, SRC Students: Heungdong Kwon, Dr. Joe Katz, Dr. Aditya Sood, Dr. Marc Dunham The most innovative energy conversion technologies, ranging from solar and thermoelectrics to lasers (which convert electric energy to light), are benefitting from nanostructures and/or nanostructured materials. Thermal phenomena play a central role in the performance and [...]

Sponsors: SRC ASCENT, Special Google-Intel Joint Contract, NSF POETS Students: Heungdong Kwon, Christopher Perez, Farid Soroush Hotspot mitigation, thermal management paths, and thermomechanical degradation are key challenges for 3D integration, in particular due to the increased quantity and complexity of "thermally critical" interfaces. The semiconductor industry (ranging from low-power portables to microprocessors and power ASICs) [...]

Sponsors: ARPA-E, NSF POETS Center, Ford, Intel, Google, Bosch Collaborators: NREL, UC Merced, Toyota, U of Arkansas, U of Illinois Urbana Champaign, Ford, Bosch Students: Sougata Hazra, Alisha Piazza, Qianying Wu, Hyun Jin Kim, Ki Wook Jung, Tanya Liu, Chi Zhang   The development of high performance heat exchangers has enjoyed a long tradition of research at Stanford University dating back [...]

Sponsors: NSF POETS Center, ARPA-E Collaborators: Google, UIUC, SRC 3D ASCENT Collaborators, U Arkansas Students: Tanya Liu, Chi Zhang, Qianying Wu Some of the best thermal management technologies use capillary forces to bring the liquid phase to hotspots for evaporative cooling, for example heat pipes and vapor chambers. The increasing complexity and power density of [...]