Publications

1999

Ju, Y.S., and Goodson, 1999, Book: "Microscale Heat Conduction in Integrated Circuits and their Constituent Films," Kluwer Academic Publishers, Boston.

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Chui, B.W., Asheghi, M., Ju, Y.S., Mamin, H.J., Goodson, K.E., and Kenny, T.W., 1999, "Measurement and Modeling of Thermal-Electrical Runaway in Silicon Cantilevers," Proceedings 10th International Conference on Solid State Sensors and Actuators, p. 1862.

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King, W.P., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 1999, "Modeling and Simulation of Sub-Micrometer Heat Transfer in AFM Thermomechanical Data Storage," ASME MEMS-Vol. 1, pp. 583-588.

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Asheghi, M., W.P. King, W.P., Chui, B.W., Kenny, T.W., and Goodson, K.E., 1999, "Thermal Engineering of Doped Single-Crystal Silicon Microcantilevers for High Density Data Storage," Proceedings 10th International Conference on Solid State Sensors and Actuators. P. 1840 (1999)

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Goodson, K.E., "Microscale Thermal Engineering of Integrated Circuits," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK 99), Maui, Hawaii, June 13-19.

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Asheghi, M., Kurabayashi, K., Goodson, K.E., Kasnavi, R., and Plummer, J.D., 1999, "Thermal Conduction in Doped Silicon Layers," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

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Ju, Y.S., and Goodson, K.E., 1999, "Measurements of the Thermal Conductivity of Monocrystalline Silicon Films," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

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Kurabayashi, K., and Goodson, K.E., 1999, "Prediction of the Thermal Conductivity Anisotropy in Linear-Chain Polymer Films," accepted for the ASME/JSME Thermal Engineering Joint Conference, San Diego, CA, March 15-19.

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Sverdrup, P.G., Ju, Y.S., and Goodson, K.E., 1999, "Impact of Heat Source Localization on Conduction Cooling of Silicon-on-Insulator Devices," Proc. International Conference on Modelling and Simulation of Microsystems, Puerto Rico, April 19-22.

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1998

Touzelbaev, M.N., and Goodson, K.E., 1998, “Applications of Micron-Scale Passive Diamond Layers for the IC and MEMS Industries,” Diamond and Related Materials, Vol. 7, pp. 1 – 14.

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Ju, Y.S., and Goodson, K.E., 1998, “Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique,” ASME Journal of Heat Transfer, Vol. 120, pp. 306-313.

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Cahill, D., Chen, G., Dresselhaus, M.S., Goodson, K.E., Ho, C.M., Longtin, J., Majumdar, A., Phinney, L., Pohl, R., Tien, C.L., Wong, C., 1998, “Report of Workshop: 2nd Microthermal Workshop and Tutorial at the Albuquerque Convention Center,” Microscale Thermophysical Engineering, Vol. 2, pp. 215-244.

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Ju, Y.S., Kurabayashi, K., and Goodson, K.E., 1998, “Thermal Characterization of IC Interconnect Passivation using Joule Heating and Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 2, pp. 101-110.

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Chaudhari, A., Woudenberg, T., Albin, M., and Goodson, K.E., 1998, “Transient Liquid-Crystal Thermometry of Microfabricated PCR Vessel Arrays,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 7, pp. 345-355.

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Chui, B.W., Stowe, T.D., Ju, Y.S., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1998, “Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage,” IEEE/ASME Journal of MicroElectroMechnical Systems, Vol. 7, pp. 69-78.

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Goodson, K.E., Ju, Y.S., and Asheghi, M., 1998, "Thermal Phenomena in Semiconductor Devices and Interconnects," in Microscale Energy Transport, C.L. Tien et al., eds., Taylor & Francis, New York, NY, pp. 229-293.

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Sverdrup, P.G., Kurabayashi, K., Ju, Y.S., Shieh, B.P., and Goodson, K.E., 1998, "Thermal Reliability Problems Posed by Novel Dielectrics," Proc. 15th International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara, CA, June 16-18, VMIC Catalog No. 98 IMIC – 108, pp. 261-266.

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Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1998, "Measurement of the Thermal Conductivity Anisotropy in Polymer Films," Proceedings of the 1998 International Mechanical Engineering Congress and Exposition, Anaheim, California, November 15-20, S. Liu et al., eds.

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Kurabayashi, K., Touzelbaev, M.N, Asheghi, M., Ju, Y.S., and Goodson, K. E., 1998, "Measurement of the Anisotropic Thermal Conductivities in Polymer Films," Proceedings of the 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Albuquerque, NM, June 14-18, B.F. Armaly et al., eds., Vol. 3, pp.187-194.

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Kurabayashi, K., and Goodson, K.E., 1998, “Precision Measurement and Mapping of Die-Attach Thermal Resistance,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. A21, pp. 506-514.

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Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1998, “Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates,” ASME Journal of Heat Transfer, Vol. 120, pp. 31-36.

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US Patent 5,843,224. Issued 1998. "Composite structure comprising a semiconductor layer arranged on a diamond or diamond-like layer and process for its production," R. Zachai, T. Gutheit, K.E. Goodson.

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1997

Touzelbaev, M.N., and Goodson K.E., 1997, “Impact of Nucleation Density on Thermal Resistance Near Diamond-Substrate Boundaries,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, pp. 506-512.

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Ju, Y.S., and Goodson, K.E., 1997, “Thermal Mapping of Interconnects Subjected to Brief Electrical Stresses,” IEEE Electron Device Letters, Vol. 18, pp. 512-514.

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Asheghi, M., Leung, Y.K., Wong, S.S., and Goodson, K.E., 1997, “Phonon-Boundary Scattering in Thin Silicon Layers,” Applied Physics Letters, Vol. 71, pp. 1798-1800.

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Ju, Y.S., Kading, O.W., Leung, Y.K., Wong, S.S., and Goodson, K. E., 1997, “Short-Timescale Thermal Mapping of Semiconductor Devices,” IEEE Electron Device Letters, Vol. 18, pp. 169-171.

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Leung, Y.-K., Paul, A.K., Goodson, K.E., Plummer, J.D., and Wong, S.S., 1997, “Heating Mechanisms of LDMOS and LIGBT in Ultrathin SOI,” IEEE Electron Device Letters, Vol. 18, pp. 414-416.

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Goodson, K.E., and Asheghi, M., 1997, “Near-Field Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 1, pp. 225-235.

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Ju, Y.S., and Goodson, K.E., 1997, “Size Effect on the Thermal Conductivity of Silicon-on-Insulator Devices under Electrostatic Discharge (ESD) Conditions,” Japanese Journal of Applied Physics, Part 2, Vol. 36, pp. L798-L800.

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Chen, G., Goodson, K.E., Grigoropoulos, C., Hipwell, M.C., Liepmann, D., Majumdar, A., Maruyama, S., Thundat, T., Tien, C.L., Tien, N.C., 1997, “Report of Workshop: Thermophysical Phenomena in Microscale Sensors, Devices, and Structures,” Microscale Thermophysical Engineering, Vol. 1, pp. 267-274.

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Ju, Y.S., and Goodson, K.E., 1997, "Impact of Phonon Dispersion upon the Size Effect on Thermal Conduction along Thin Semiconductor Films," Proceedings of the 1997 International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, in Microscale Energy Transport, K.E. Goodson et al., eds., HTD-Vol. 354, pp. 181-190.

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Schuder, R.G., and Goodson, K.E., 1997, "Integrated Circuits and MicroElectroMechanical Systems in the Heat Transfer Teaching Laboratory," ASME Proceedings of the 32nd National Heat Transfer Conference, Baltimore, Maryland, August 7-10, in Innovations in Heat Transfer Education, HTD-Vol. 344, M. Bianchi et al., eds., pp. 83-92.

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Kurabayashi, K., Touzelbaev, M.N., Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, "Measurement of the Anisotropic Thermal Conductivity in Polymer Thin Films for Low-Dielectric-Constant Passivation," Proc. 3rd International Workshop on Thermal Investigations of ICs and Microstructures, Cannes, France, September 21-23.

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Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, "Thermal Conductivity of SOI Device Layers," Proceedings of the IEEE International SOI Conference, Tenaya Lodge at Yosemite, Fish Camp, California, October 6-9, IEEE Vol. 97CH36069, pp. 134-135.

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Chui, B.W., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D, and Rugar, D. "Micromachined heaters with 1-us thermal time constants for AFM thermomechanical data storage," Proceedings of the International Conference on Solid-state Sensors and Actuators, Transducers, Chicago, Illinois, June, 1997.

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Ju, Y.S., and Goodson, K.E., 1997, "Short-Timescale Thermal Mapping of Interconnects," Proceedings of the 35th IEEE International Reliability Physics Symposium, Denver, Colorado, April 8-10, IEEE Catalog No. 97CH35983, pp. 320-324.

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Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1997, “Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B20, pp. 104-109.

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1996

Chui, B.W., Stowe, T.D., Ju, Y. S., Soh, H.T., Minne, S.C., Goodson, K.E., Quate, C.F., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1996, "Improved Cantilevers for AFM Thermomechanical Data Storage," Proceedings of the Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 2-6, pp. 219-224.

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Ju, Y.S., and Goodson, K.E., 1996, "Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits," Proceedings of the International Mechanical Engineering Congress and Exposition, Atlanta, GA, November 17-22, in Micro-Electro-Mechanical Systems (MEMS), DSC-Vol. 59, C. T. Avedisian et al., eds., pp. 31-36.

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Touzelbaev, M.N., and Goodson K.E., 1996, "Impact of Nucleation Density on the Thermal Resistance near Diamond-Substrate Boundaries," Proceedings of the ASME/AIChE National Heat Transfer Conference, Houston, Texas, August 3-6, Vol. 5, R. L. Mahajan et al., eds., pp. 193-200.

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Goodson, K.E., Ju., Y.S., Asheghi, M., Kading, O.W., Touzelbaev, M.N., Leung, Y.K., and Wong, S.S., 1996, "Microscale Thermal Characterization of High-Power Silicon-on-Insulator Transistors," Proceedings of the 31st ASME National Heat Transfer Conference, Houston, Texas, August 3-6,
Vol. 5, R. L. Mahajan et al., eds., pp. 1-9.

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Goodson, K.E., 1996, “Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures,” ASME Journal of Heat Transfer, Vol. 118, pp. 279-286.

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1995

Goodson, K.E., 1995, "Impact of CVD Diamond Layers on the Thermal Engineering of Electronic Systems," in the Annual Review of Heat Transfer, C.L. Tien, ed., Begell House, New York, NY, Vol. 6, pp. 323-353

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Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, “Thermal Conduction normal to Diamond-Silicon Boundaries,” Applied Physics Letters, Vol. 66, pp. 3134-3136.

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Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, “Experimental Investigation of Thermal Conduction normal to Diamond-Silicon Boundaries,” Journal of Applied Physics, Vol. 77, pp. 1385-1392.

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Goodson, K.E., and Cooper P.T., 1995, "The Effect of High-Energy Electrons on Lattice Conduction in Semiconductor Devices," Proceedings of the Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien, Berkeley, California, November 14, R. Buckius, ed., pp. 153-159.

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Leung, Y.-K., Suzuki, Y., Goodson, K.E., and Wong, S.S., 1995, "Self-Heating Effect in Lateral DMOS on SOI," Proceedings of the Seventh International Symposium on Power Devices and Integrated Circuits, H. Ahashi, Y. Uchida, and Y. Sugawara, eds., Yokohama, Japan, May 23-25, pp. 136-140.

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Goodson, K.E., and Touzelbaev, M. N., 1995, "Effective Thermal Resistance at Diamond Boundaries in MEMS," presented at the Micromechanical Systems Panel Symposium at the ASME International Congress and Exposition, San Francisco, California, November 12-17, in Proceedings of the ASME Dynamic Systems and Control Division, DSC-Vol. 57-2, T.E. Alberts, ed., ASME Press., New York, pp. 925-930.

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Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1995, “Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits,” ASME Journal of Heat Transfer, Vol. 117, pp. 574-581.

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1994

Kading, O.W., Skurk, H., and Goodson, K.E., 1994, “Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon,” Applied Physics Letters, Vol. 65, pp. 1629-1631.

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