Xiong, F., Wang, H., Sood, A., Liu, X., Sun, J., Brongersma, M., Goodson, K.E., Pop, E., Cui, Y., "Tuning Electrical, Optical and Thermal Properties in MoS2 Nanosheets via Li Intercalation," Materials Research Society (MRS) Spring Meeting, April 2016, Phoenix, AZ
Yates, L., Sood, A., Cheng, Z., Bougher, T., Malcolm, K., Cho, J., Asheghi, M., Goodson, K.E., Goorsky, M., Faili, F., Twitchen, D., Graham, S., “Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices”, IEEE Compound Semiconductor IC Symposium (CSICS), October 2016, Austin, TX
Shin, Y.C., Sood, A., Smithe, K.K.H., Goodson, K.E., Pop, E., “Optical and Thermal Properties of Heterogeneously Integrated CVD-Grown 2D Materials”, Materials Research Society (MRS) Fall Meeting, November 2016, Boston, MA
Katz, J., Asheghi, M., Xia, Y., Goodson, K.E., "Thermal Conductivity Measurement of Polymer Thin Films by the 3w Method Using Nanostencil Patterning," SRC TechCon, September 2016, Austin, TX
Liu, T., Lingamneni, S., Palko, J., Asheghi, M., Goodson, K.E.., “Optimization of hybrid wick structures for extreme spreading in high performance vapor chambers”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2016, May 31 – June 3, Las Vegas, NV, USA.
Barako, M.T., Roy-Panzer, S., Kodama, T., Asheghi, M., Goodson, K.E., “Thermal Conduction in Vertically-Aligned Copper Nanowire Arrays,” Materials Research Society (MRS) Spring Meeting, April 6-10, 2015, San Francisco, CA
Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Kazemi, H., Vanhille, K., Asheghi, M., Goodson, K.E., “Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density GaN-SiC chip”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, […]
Lee, H., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K.E., “Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Zhang,C., Rong,G., Palko,J.W., Dusseault,T.J., Asheghi,M., Santiago,J.G., Goodson,K.E., “Tailoring of permeability in copper inverse opals for electronics cooling applications,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Houshmand, F., Lee, H., Asheghi, M., Goodson, K.E., “High heat flux subcooled flow boiling of methanol in microtubes,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA