Cho, J., Sood, A., Hayee, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of Nanocrystalline Diamond Films on Silicon”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA.
Scholl, S., Gorle, C., Houshmand, F., Liu, T., Lee, H., Won, Y., Asheghi, M., Goodson, K.E., Kazemi, H., “Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Scholl, S., Gorle, C., Houshmand, F., Asheghi, M., Goodson, K.E., Verstraete, T., “Numerical optimization of advanced monolithic microcoolers for high heat flux microelectronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Gorle, C., Lee, H., Houshmand, F., Asheghi, M., Goodson, K.E., Parida, P.R., “Validation study for VOF simulations of boiling in a microchannel,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Won, Y., Sood, A., Katz, J., Asheghi, M., Li, Y., Owen, G., Zhu, M., Goodson, K.E., “Thermal Management of QCL Devices & Packaging”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Palko, J. W., Dusseault, T., Zhang, C., Wilbur, J., Ashegi, M., Goodson, K. E., Santiago, J. G., “Localized, High Heat Flux, Two Phase Cooling Using Capillary Fed Porous Structures,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA
Palko, J. W., Houshmand, F., Wilbur, J., Zhang, C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D., Jung, K-W, Asheghi, M., Santiago, J. G., Goodson, K. E., “Capillary Fed Two Phase Cooling Beyond 1kW/cm2 in Short Wicking Length, Joule‐Heated, Microporous Copper Layers,” 9th International Conference on Boiling and Condensation Heat Transfer, 2015, April […]
Won, Y., Lee, H., Barako, M. T., Jung, K-W, Zhang, C., Dusseault, T., Houshmand, F., Palko, J. W., Agonafer, D., Asheghi, M., Santiago, J. G., Goodson, K. E., “Structure Dependent Wettability on Copper Inverse Opals”, 9th International Conference on Boiling and Condensation Heat Transfer, 2015, April 26-29, Boulder, CO
Dunham, M. T., Lorenzi, B., Sood, A., Tonini, R., Ottaviani, G., Asheghi, M., Narducci, D., and Goodson, K. E., "Impact of nanovoids on the thermal conductivity of heavily-doped nanosilicon thin films," ASME International Mechanical Engineering Congress and Exposition (IMECE) 2014, November 14-20, Montreal, Canada.
T.J. Dusseault, J. Gires, M.T. Barako, Y. Won, D.D. Agonafer, M. Asheghi, J.G. Santiago, K.E. Goodson, “Inverse Opals for Fluid Delivery in Electronics Cooling Systems,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.