Barako, M.T., Park, W., Marconnet, A.M., Asheghi, M., and Goodson, K.E. “A Reliability Study with Infrared Imaging of Thermoelectric Modules under Thermal Cycling”. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA
Bozorg-Grayeli, E., Li, Z., Gambin, V., Asheghi, M., and Goodson, K.E., “Thermal Conductivity, Anisotropy, and Interface Resistances of Diamond on Poly-AlN”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May i30 – June 1, San Dego, CA
Aminfar, A., Bozorg-Grayeli, E., Asheghi, M., and Goodson, K.E., “Analysis of HEMT Multilayered Structures Using a 2D Finite Volume Model”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA
Barako, M.T., Gao, Y., Marconnet, A.M., Asheghi, M., Goodson, K.E. “Solder-Bonded Carbon Nanotube Thermal Interface Materials.” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA.
Li, Z., Tan, S., Kodama, T., Bozorg-Grayeli, E., Asheghi, M., Goodson, K.E., “Electron-Phonon Coupled Two-Dimensional Heat Transfer in Nanoscale Metal/Dielectric Multilayers,” Proceedings of the ASME Summer Heat Transfer Conference, 2012, July 8-12, Rio Grande, Puerto Rico
Park, W., Barako, M.T., Marconnet, A.M., Asheghi, M., and Goodson, K.E. “Effect of Thermal Cycling on Commercial Thermoelectric Modules”. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA
T. Kodama, W. Park, A. Marconnet, J. Lee, M. Asheghi, K. E. Goodson, 2012, “In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configurations”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA
Hom, L., Durieux, A., Miler, J., Asheghi, M., Ramani, K., Goodson, K.E. “Calibration Methodology for Interposing Liquid Coolants for Infrared Thermography of Microprocessors”. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA
Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Altman, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of Composite GaN Substrates for HEMT Applications,” Government Microcircuit Applications & Ctritical Technology (GomacTech) Conferfence 2012, March 18-20, Las Vegas, Nevada
Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of GaN-on-Diamond Substrates for HEMT Applications,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Dego, CA