Journal Publications

Liu, T., Asheghi, M., & Goodson, K. E. (2021). Performance and Manufacturing of Silicon-Based Vapor Chambers. Applied Mechanics Reviews, 73(1), 010802

Kwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., & Goodson, K. E. (2021). Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.0c19197

Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., “Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films,” (2021) ACS Nano Letters, submitted and under review.

Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241

Park, J., Bae, K., Kim, T. R., Perez, C., Sood, A., Asheghi, M., Goodson, K. E., Park, W, 2020, Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter. Advanced Science, 2002876, 8

Hinckley, A. C., Andrews, S. C., Dunham, M., Sood, A., Barako, M. T., Schneider, S., Toney, M. F., Goodson, K. E., Bao, Z., 2021 “Achieving High Thermoelectric Performance and Metallic Transport in Solvent-Sheared PEDOT:PSS”, Advanced Electronic Materials, 2001190

Xiong, F., Yalon, E., McClellan, C. M., Zhang, J., Aslan, O. B., Sood, A., Sun, J., Andolina, C., Al-Saidi, W., Goodson, K. E., Heinz, T. F., Cui, Y., Pop, E. 2021 “Tuning Electrical and Interfacial Thermal Properties of Bilayer MoS2 via Electrochemical Intercalation”, Nanotechnology, 32, 26520

Chen, M. E., Rojo, M. M., Lian, F., Koeln, J., Sood, A., Bohaichuk, S. M., Neumann, C. M., Garrow, S. G., Alleyne, A. G., Goodson, K. E., Pop, E., “Graphene-Based Electromechanical Thermal Switches”, 2D Materials, in press.

Jung, D., Lee, H., Kong, D., Cho, E., Jung, K.W., Kharangate, C.R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “Thermal Design and Management of Micro-Pin Fin Heat Sinks for Energy-Efficient Three-Dimensional Stacked Integrated Circuits.” International Journal of Heat and Mass Transfer, vol. 175, 2021, p. 121192., doi:10.1016/j.ijheatmasstransfer.2021.121192

Lee, H., Kang, M., Jung, K.W., Kharangate, C.R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “An Artificial Neural Network Model for Predicting Frictional Pressure Drop in Micro-Pin Fin Heat Sink.” Applied Thermal Engineering, 2021, p. 117012., doi:10.1016/j.applthermaleng.2021.117012