Heat Conduction through a DNA-Gold Composite
Kodama, T., Jain, A., and Goodson K.E., 2009, “Heat Conduction through a DNA-Gold Composite,” Nano Letters, Vol. 9, pp 2005-2009.
Kodama, T., Jain, A., and Goodson K.E., 2009, “Heat Conduction through a DNA-Gold Composite,” Nano Letters, Vol. 9, pp 2005-2009.
Rowlette, J.A., Kekatpure, R.D., Panzer, M.A., Brongersma, M.L., and Goodson, K.E., 2009, “Nonradiative Recombination in Strongly Interacting Silicon Nanocrystals Embedded in Amorphous Silicon-Oxide Films,” Physical Review B, Vol. 80, 045314.
Hu, X., Jain, A., and Goodson, K.E., 2008, “Investigation of the Natural Convection Boundary Condition in Microfabricated Structures,” International Journal of Thermal Sciences, Vol. 47, pp. 820-824.
Panzer, M.P., and Goodson, K.E., 2008, “Thermal Resistance Between Low-Dimensional Nanostructures and Semi-Infinite Media,” Journal of Applied Physics, Vol. 103, pp. 094301.
Jain, A., and Goodson, K.E., 2008, “Measurement of the Thermal Conductivity and Heat Capacity of Free-Standing Shape Memory Thin Films using the 3w Method,” ASME Journal of Heat Transfer, Vol. 130, 102402.
Panzer, M.A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., and Goodson, K.E., 2008, “Thermal Properties of Metal-Coated Vertically-Aligned Single-Wall Nanotube Arrays,” ASME Journal of Heat Transfer, Vol. 130, 052401.
Reifenberg, J.P., Kencke, D.L., and Goodson, K.E., 2008, “The Impact of Thermal Boundary Resistance in Phase-Change Memory Devices,” IEEE Electron Device Letters, Vol. 29, pp. 1112-1114.
Gharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2008, “Diffusion, Aggregation, and the Thermal Conductivity of Nanofluids,” Applied Physics Letters, Vol. 93, 103110.
Oh, D.W., Jain, A., Eaton J.K., Goodson K.E., and Lee, J.S., 2008, “Thermal Conductivity Measurement and Sedimentation Detection of Aluminum Oxide Nanofluids by using the 3 Omega Method,” International Journal of Heat and Fluid Flow, Vol. 29, pp. 1456-1461.
Fang, C., Hidrovo, C., Wang, F.M., Eaton, J., and Goodson, K.E., 2008, “3-D Numerical Simulation of Contact Angle Hysteresis for Microscale Two-Phase Flow,” International Journal of Multiphase Flow, Vol. 34, pp. 690-705.