Kodama, Ohnishi, Park, Shiga, Park, Shimada, Shinohara, Shiomi, Goodson, 2017, “Modulation of Thermal and Thermoelectric Transport in Individual Carbon Nanotubes by Fullerene Encapsulation,” Nature Materials, Vol. 16, pp. 892-897.
Barako, M.T., Isaacson, S.G., Lian, F., Pop, E., Dauskardt, R.H., Goodson, K.E., and Tice, J., 2017, “Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials,” ACS Applied Materials & Interfaces, Vol. 9, article 42067.
Lee, H., Agonafer, D. D., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K. E., 2016, “Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices,” Journal of Electronic Packaging, Vol. 138, 010907.
Barako, M.T., Sood, A., Zhang, C., Wang, J., Kodama, T., Asheghi, M., Zheng, X.L., Braun, P.V., and Goodson, K.E., 2016, “Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals,” Nano Letters, Vol. 16, pp. DOI: 10.1021/acs.nanolett.6b00468
Sood, A., Cho, J., Hobart, K.D., Feygelson, T.I., Pate, B.B., Asheghi, M., Cahill, D.G., and Goodson, K.E., 2016, “Anisotropic and Inhomogeneous Thermal Conduction in Suspended Thin-Film Polycrystalline Diamond,” Journal of Applied Physics, Vol. 119, 175103.
Fong, S.W., Sood, A., Chen, L., Kumari, N., Asheghi, M., Goodson, K.E., Gibson, G.A., and H.S.P. Wong, 2016, “Thermal Conductivity Measurement of Amorphous Dielectric Multilayers for Phase-Change Memory Power Reduction,” Journal of Applied Physics, Vol. 120, 015103.
Dunham, M. T., Lorenzi, B., Andrews, S., Sood, A., Asheghi, M., Narducci, D., Goodson, K.E., 2016, “Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films,” Applied Physics Letters, Vol. 109, 253104.
Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K.E., 2015, “Fundamental Cooling Limits for High Power Density GaN Electronics,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, pp. 737-744.
Chiriac, V., Malloy, S., Anderson, J., and Goodson K.E., 2015, “A Figure of Merit for Smart Phone Thermal Management,” Electronics Cooling, Vol. 17, pp. 18-23.
Shi, L., Dames, C., Likes, J.R., Reddy, P.S., Duda, J., Cahill, D.G., Lee, J., Marconnet, A., Goodson, K.E., Bahk, J.-H., Shakouri, A., Prasher, R.S., Felts, J., King, W.P., Han, B., Bischof, J.C., 2015, “Evaluating Broader Impacts of Nanoscale Thermal Transport Research,” Nanoscale and Microscale Thermophysical Engineering, Vol. 19, pp. 127-165.