Barako, M.T., Weisse, J.M., Roy, S., Kodama, T.,Dusseault, T.J., Motoyama, M., Asheghi, M., Prinz, F.B., Zheng, X., and Goodson, K.E., “Thermal Conduction in Nanoporous Copper Inverse Opal Films,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Guzman, P.A.V., Sood, A., Mleczko, M.J., Wang, B., Wong, -H.S.P., Nishi, Y., Asheghi, M., Goodson, K.E., “Cross Plane Thermal Conductance of Graphene-Metal Interfaces,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Lingamneni, S., Asheghi, M., and Goodson, K.E., “A Parametric Study of Microporous Metal Matrix-Phase Change Material Composite Heat Spreaders for Transient Thermal Applications,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Sood, A., Eryilmaz, S.B., Jeyasingh, R., Cho, J., Asheghi, M., Wong, -H.S.P, Goodson, K.E., “Thermal Characterization of Nanostructured Superlattices of TiN/TaN: Applications as Electrodes in Phase Change Memory” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Sood, A., Cho, J., Hobart, K.D., Feygelson, T., Pate, B., Asheghi, M., Goodson, K.E., “Anisotropic and Nonhomogeneous Thermal Conduction in 1 µm Thick CVD Diamond”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Park, W., Marconnet, A. M., Kodama, T., Park, J., Sinclair, R., Asheghi, M., Goodson, K.E., “Phonon Thermal Conduction in Periodically Porous Silicon Nanobeams”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Cho, J., Chu, K.K., Chao, P.C., McGray, C., Asheghi, M., and Goodson, K.E., “Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Agonafer, D.A., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J.G., Goodson, K.E., “Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-GLASS Capillaries,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Won, Y., Barako, M., Agonafer, D. A., Asheghi, M., Goodson, K. E., “Mechanical Properties of Nanostructured Porous Layers for Two-Phase Convection Enhancement”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
Tyhach, M., Altman, D., Bernstein, S., Korenstein, R., Cho, J., Goodson, K.E., Francis, D., Faili, F., Ejeckam, F., Kim, S., and Graham, S., “S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates,” IEEE Lester Eastman Conference on High Performance Devices (LEC) 2014, Aug. 5-7, Ithaca, NY, USA.