Ju, Y.S., and Goodson, K.E., 1999, “Process-Dependent Thermal Transport Properties of Silicon Dioxide Films Deposited using Low-Pressure Chemical Vapor Deposited,” Journal of Applied Physics, Vol. 85, pp. 7130-7134.
Chui, B.W., Asheghi, M., Ju, Y.S., Goodson, K.E., Kenny, T.W., and Mamin, H.J., 1999, “Intrinsic-Carrier Thermal Runaway in Silicon Microcantilevers,” Microscale Thermophysical Engineering, Vol. 3, pp. 217-224.
Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1999, “Measurement of the Thermal Conductivity Anisotropy in Polyimide Films,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 8, pp. 180-191.
Ju, Y.S., and Goodson, K.E., 1999, “Phonon Scattering in Silicon Films of Thickness Below 100 nm,” Applied Physics Letters, Vol. 74, pp. 3005-3007.
Kurabayashi, K., and Goodson, K.E., 1999, “Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films,” Journal of Applied Physics, Vol. 86, pp. 1925-1931.
Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1998, “Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates,” ASME Journal of Heat Transfer, Vol. 120, pp. 31-36.
Kurabayashi, K., and Goodson, K.E., 1998, “Precision Measurement and Mapping of Die-Attach Thermal Resistance,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. A21, pp. 506-514.
Chui, B.W., Stowe, T.D., Ju, Y.S., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1998, “Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage,” IEEE/ASME Journal of MicroElectroMechnical Systems, Vol. 7, pp. 69-78.
Chaudhari, A., Woudenberg, T., Albin, M., and Goodson, K.E., 1998, “Transient Liquid-Crystal Thermometry of Microfabricated PCR Vessel Arrays,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 7, pp. 345-355.
Ju, Y.S., Kurabayashi, K., and Goodson, K.E., 1998, “Thermal Characterization of IC Interconnect Passivation using Joule Heating and Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 2, pp. 101-110.