Cahill, D., Chen, G., Dresselhaus, M.S., Goodson, K.E., Ho, C.M., Longtin, J., Majumdar, A., Phinney, L., Pohl, R., Tien, C.L., Wong, C., 1998, “Report of Workshop: 2nd Microthermal Workshop and Tutorial at the Albuquerque Convention Center,” Microscale Thermophysical Engineering, Vol. 2, pp. 215-244.
Ju, Y.S., and Goodson, K.E., 1998, “Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique,” ASME Journal of Heat Transfer, Vol. 120, pp. 306-313.
Touzelbaev, M.N., and Goodson, K.E., 1998, “Applications of Micron-Scale Passive Diamond Layers for the IC and MEMS Industries,” Diamond and Related Materials, Vol. 7, pp. 1 – 14.
Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1997, “Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B20, pp. 104-109.
Chen, G., Goodson, K.E., Grigoropoulos, C., Hipwell, M.C., Liepmann, D., Majumdar, A., Maruyama, S., Thundat, T., Tien, C.L., Tien, N.C., 1997, “Report of Workshop: Thermophysical Phenomena in Microscale Sensors, Devices, and Structures,” Microscale Thermophysical Engineering, Vol. 1, pp. 267-274.
Ju, Y.S., and Goodson, K.E., 1997, “Size Effect on the Thermal Conductivity of Silicon-on-Insulator Devices under Electrostatic Discharge (ESD) Conditions,” Japanese Journal of Applied Physics, Part 2, Vol. 36, pp. L798-L800.
Goodson, K.E., and Asheghi, M., 1997, “Near-Field Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 1, pp. 225-235.
Leung, Y.-K., Paul, A.K., Goodson, K.E., Plummer, J.D., and Wong, S.S., 1997, “Heating Mechanisms of LDMOS and LIGBT in Ultrathin SOI,” IEEE Electron Device Letters, Vol. 18, pp. 414-416.
Ju, Y.S., Kading, O.W., Leung, Y.K., Wong, S.S., and Goodson, K. E., 1997, “Short-Timescale Thermal Mapping of Semiconductor Devices,” IEEE Electron Device Letters, Vol. 18, pp. 169-171.
Asheghi, M., Leung, Y.K., Wong, S.S., and Goodson, K.E., 1997, “Phonon-Boundary Scattering in Thin Silicon Layers,” Applied Physics Letters, Vol. 71, pp. 1798-1800.